The curing shrinkage of electronic chemicals three anti-corrosion glue is a key factor affecting stress distribution in precision electronic components. Its mechanism of action spans the entire lifecycle from material curing to component service and long-term reliability. During the curing process, as electronic chemicals three anti-corrosion glue transitions from liquid to solid, cross-linking reactions between molecular chains induce volumetric shrinkage. If the shrinkage is too high, uneven shrinkage can generate tensile stress at the interface between the glue and the component. This stress can directly lead to component pin breakage, solder joint delamination, or substrate deformation. For example, when electronic chemicals three anti-corrosion glue is applied to flexible printed circuits, high shrinkage can cause board bending, placing additional mechanical loads on surface-mounted devices, leading to microcrack propagation and hidden damage.
The stress concentration caused by curing shrinkage is particularly pronounced in precision components. Due to the complex structure of components and the varying geometries and material properties of different regions, the stress distribution during shrinkage exhibits non-uniformity. At chip package edges, BGA solder ball arrays, or corners of unusually shaped components, stress concentration factors can reach several times the average stress, causing localized stresses to exceed the material fatigue limit. This hidden damage is difficult to detect during short-term testing, but over long-term service, the stress will gradually release through creep mechanisms, leading to failure modes such as solder voiding and interface delamination, significantly shortening component life.
The coupled effect of thermal stress and curing shrinkage stress further exacerbates component reliability risks. During electronic device operation, temperature cycling can cause a mismatch between the coefficient of thermal expansion (CTE) of the anti-corrosion glue and the component. If the curing shrinkage rate is not effectively controlled, the initial stress field will be superimposed on the thermal stress, resulting in a compound stress state. For example, during extreme temperature cycling, high-shrinkage anti-corrosion glue may subject the solder joint to alternating stresses exceeding its yield strength, accelerating fatigue crack initiation and propagation, and ultimately leading to electrical connection failure.
The impact of material compatibility on shrinkage stress is also not negligible. The chemical bond strength between the anti-corrosion glue and the component surface material directly affects the efficiency of stress transfer. When the interfacial bonding between the colloid and the metal, ceramic, or plastic substrate is weak, shrinkage stress will be concentrated at the interface, causing debonding or coating peeling. Conversely, if the interface is too tight, shrinkage stress may be directly transmitted into the component interior, causing fracture of brittle materials. Therefore, surface treatment or additive modification is necessary to optimize interfacial compatibility and achieve stress buffering.
Process parameters have a dual effect on shrinkage stress. Process conditions such as curing temperature, ramp rate, and dwell time directly affect the crosslink density and shrinkage rate of electronic chemicals three anti-corrosion glue. While rapid curing can improve production efficiency, it may prevent shrinkage stress from relaxing, resulting in residual stress. While staged curing can reduce instantaneous shrinkage, it may reduce long-term dimensional stability due to insufficient crosslinking. Therefore, it is necessary to optimize the process window to balance shrinkage stress and production efficiency.
The long-term impact of environmental compatibility on shrinkage stress must also be considered. In humid or corrosive environments, electronic chemicals three anti-corrosion glue may swell upon absorbing moisture, resulting in a negative volume change. If the initial cure shrinkage is too high, the compressive stress generated by swelling may combine with residual tensile stress, causing coating cracking or component displacement. Furthermore, UV aging can degrade the cross-linked structure of the colloid, further altering the distribution of shrinkage stress, creating a dynamic stress field and accelerating component failure.
Mitigating the impact of shrinkage stress requires a systematic design strategy. Developing low-shrinkage anti-corrosion glues through molecular structural design can fundamentally reduce the source of shrinkage stress. Incorporating local reinforcement or stress-dispersing structures can reduce stress concentration factors. Establishing stress prediction models based on finite element analysis can provide theoretical guidance for anti-corrosion glue selection and process optimization. For example, flexible coatings with low glass transition temperatures (Tg) can reduce stress in low-temperature environments, while nanofiller modification can improve the dimensional stability of the colloid. Together, these measures constitute a comprehensive solution for stress control in precision electronic components.
