How does the electronic chemical Three Anti-Corrosion Glue form a dense protective film on the surface of electronic components without affecting conductivity?
Publish Time: 2025-10-30
With the increasing miniaturization and high-density integration of modern electronic devices, the operating environment of these components is becoming increasingly harsh—threats such as humidity, salt spray, dust, temperature cycling, and chemical corrosion are ubiquitous. To ensure the long-term stable operation of circuits, the electronic chemical "Three Anti-Corrosion Glue" has emerged. This high-performance protective material, composed of three components, can form a dense, transparent, and flexible protective film on the surface of electronic components, effectively isolating them from external corrosion.1. Synergistic Reaction of Three Components: Building a Dense, Pore-Free Protective BarrierThe core advantage of Three Anti-Corrosion Glue lies in its multi-component formulation design. The first component is typically the main resin containing active functional groups, the second is a specialized curing agent, and the third may contain functional additives such as accelerators, leveling agents, or nanofillers. During use, the three components are mixed in precise proportions, triggering a rapid cross-linking reaction to form a three-dimensional network polymer structure. This in-situ curing film-forming process has extremely strong "self-filling" capabilities. The adhesive spreads evenly on the component surface under capillary action, penetrating tiny gaps, solder joint edges, and pin bottoms. After curing, it forms a seamless, continuous protective layer, completely blocking the penetration paths of corrosive media such as moisture, chloride ions, and sulfides. Compared to traditional spraying or dipping coatings, the three-component system, due to its more complete reaction and lower shrinkage, forms a denser film with near-zero porosity, achieving true "airtight" protection.2. Selective Coating Technology: Precisely Avoiding Conductive AreasAlthough anti-corrosion adhesives possess excellent insulating properties, applying them to contacts, terminals, switch contacts, or test points that require conductivity can still lead to circuit failure. Therefore, the key to "not affecting conductivity" is not changing the adhesive itself, but rather the precise coating process. Modern electronics manufacturing widely employs selective coating technology, using automated equipment to precisely apply anti-corrosion adhesive to the areas requiring protection, actively avoiding conductive parts such as gold fingers, connectors, screw holes, and debugging interfaces. Three anti-corrosion glue, with its adjustable viscosity, excellent leveling properties, and fast curing speed, is particularly suitable for high-precision operations, ensuring "full coverage where protection is needed and unobstructed passage where necessary." Furthermore, some high-end anti-corrosion glues possess "area recognition" characteristics, enabling localized repairs through UV fluorescence or specific solvents. During repairs, the solvent dissolves the coating in a specific area, exposing the solder joints for welding. After repair, a second coat is applied, ensuring maintainability without compromising the overall protective integrity.3. Material Intrinsic Optimization: Balancing Insulation and CompatibilityThree anti-corrosion glue's formulation design also fully considers compatibility with electronic systems. First, its cured volume resistivity is extremely high, and its dielectric strength is excellent, ensuring no leakage or breakdown even under high-voltage environments. Second, the glue itself contains no ionic impurities, avoiding electrochemical corrosion caused by residual ion migration. More importantly, this type of glue produces almost no byproducts during curing, exhibiting low stress and low shrinkage, preventing mechanical damage or thermal shock to sensitive components. Its coefficient of thermal expansion matches that of the PCB substrate, ensuring long-term insulation and protection even under repeated cycling within a wide temperature range of -40℃ to +150℃ without cracking or delamination due to stress accumulation.4. Transparency and Thinness: Dual Guarantee of Visual and Functional PerformanceThree anti-corrosion glue is typically a transparent or slightly yellow liquid that maintains high light transmittance after curing, facilitating visual inspection of solder joint quality and component status. Simultaneously, its film thickness can be controlled between 25~75μm, classifying it as a "thin-film" protection that neither affects component heat dissipation nor adds extra space, making it particularly suitable for high-density assembly in consumer electronics, automotive electronics, and industrial control modules.The reason why the electronic chemical Three anti-corrosion glue can form a dense protective film without affecting conductivity relies on a three-pronged solution of "materials-process-design": constructing a defect-free barrier through a three-component chemical reaction, achieving precise coverage through selective coating technology, and supplementing this with the intrinsic properties of high-purity, low-stress materials, ultimately achieving a perfect balance between "protection" and "conductivity." It is not only the "invisible armor" of electronic products, but also a key part of reliability engineering in modern intelligent manufacturing, silently protecting the stable operation of every piece of equipment.
